Transient risk of water layer formation on PCBAs in different climates: Climate data analysis and experimental study.

MLA

Conseil-Gudla, Helene, et al. “Transient Risk of Water Layer Formation on PCBAs in Different Climates: Climate Data Analysis and Experimental Study.” Microelectronics Reliability, vol. 136, Sept. 2022, p. N.PAG. EBSCOhost, https://doi.org/10.1016/j.microrel.2022.114655.

APA

Conseil-Gudla, H., Spooner, M., Kulahci, M., & Ambat, R. (2022). Transient risk of water layer formation on PCBAs in different climates: Climate data analysis and experimental study. Microelectronics Reliability, 136, N.PAG. https://doi.org/10.1016/j.microrel.2022.114655

Chicago

Conseil-Gudla, Helene, Max Spooner, Murat Kulahci, and Rajan Ambat. 2022. “Transient Risk of Water Layer Formation on PCBAs in Different Climates: Climate Data Analysis and Experimental Study.” Microelectronics Reliability 136 (September): N.PAG. doi:10.1016/j.microrel.2022.114655.