Cite
Size-Dependent Metal-Embedded Packaging for Performance Enhancement in Quantum-Dot-Converted Light-Emitting Diodes.
MLA
Huang, Chung-Ping, et al. “Size-Dependent Metal-Embedded Packaging for Performance Enhancement in Quantum-Dot-Converted Light-Emitting Diodes.” IEEE Transactions on Electron Devices, vol. 69, no. 8, Aug. 2022, pp. 4317–24. EBSCOhost, https://doi.org/10.1109/TED.2022.3181223.
APA
Huang, C.-P., Lin, G.-T., Yang, J.-J., & Lin, C.-C. (2022). Size-Dependent Metal-Embedded Packaging for Performance Enhancement in Quantum-Dot-Converted Light-Emitting Diodes. IEEE Transactions on Electron Devices, 69(8), 4317–4324. https://doi.org/10.1109/TED.2022.3181223
Chicago
Huang, Chung-Ping, Guan-Teng Lin, Jhen-Jia Yang, and Chien-Chung Lin. 2022. “Size-Dependent Metal-Embedded Packaging for Performance Enhancement in Quantum-Dot-Converted Light-Emitting Diodes.” IEEE Transactions on Electron Devices 69 (8): 4317–24. doi:10.1109/TED.2022.3181223.