Investigation of mechanical force acting on the surface modified-substrate layer area during the chemical-mechanical micro-grinding of monocrystalline silicon.

MLA

Li, Wei, et al. “Investigation of Mechanical Force Acting on the Surface Modified-Substrate Layer Area during the Chemical-Mechanical Micro-Grinding of Monocrystalline Silicon.” International Journal of Mechanical Sciences, vol. 228, Aug. 2022, p. N.PAG. EBSCOhost, https://doi.org/10.1016/j.ijmecsci.2022.107482.

APA

Li, W., Jiao, Y., Jiang, H.-Y., Ren, Y.-H., & Ibrahim, A. M. M. (2022). Investigation of mechanical force acting on the surface modified-substrate layer area during the chemical-mechanical micro-grinding of monocrystalline silicon. International Journal of Mechanical Sciences, 228, N.PAG. https://doi.org/10.1016/j.ijmecsci.2022.107482

Chicago

Li, Wei, Yi Jiao, Hai-Yang Jiang, Ying-Hui Ren, and Ahmed Mohamed Mahmoud Ibrahim. 2022. “Investigation of Mechanical Force Acting on the Surface Modified-Substrate Layer Area during the Chemical-Mechanical Micro-Grinding of Monocrystalline Silicon.” International Journal of Mechanical Sciences 228 (August): N.PAG. doi:10.1016/j.ijmecsci.2022.107482.