Direct-write formation of integrated bottom contacts to laser-induced graphene-like carbon.

We report a simple, scalable two-step method for direct-write laser fabrication of 3D, porous graphene-like carbon electrodes from polyimide films with integrated contact plugs to underlying metal layers (Au or Ni). Irradiation at high average CO2 laser power (30 W) and low scan speed (∼18 mm s)âˆ'1 leads to formation of ‘keyhole’ contact plugs through local ablation of polyimide (initial thickness 17 ÎĽ m) and graphitization of the plug perimeter wall. Top-surface laser-induced graphene (LIG) electrodes are then formed and connected to the plug by raster patterning at lower laser power (3.7 W) and higher scan speed (200 mm s)âˆ'1. Sheet resistance data (71 ± 15 Ω sq.)âˆ'1 indicates formation of high-quality surface LIG, consistent with Raman data which yield sharp first- and second-order peaks. We have also demonstrated that high-quality LIG requires a minimum initial polyimide thickness. Capacitance data measured between surface LIG electrodes and the buried metal film indicate a polyimide layer of thickness ∼7 ÎĽ m remaining following laser processing. By contrast, laser graphitization of polyimide of initial thickness ∼8 ÎĽ m yielded devices with large sheet resistance (>1 kΩ sq.)âˆ'1. Raman data also indicated significant disorder. Plug contact resistance values were calculated from analysis of transfer line measurement data for single- and multi-plug test structures. Contacts to buried nickel layers yielded lower plug resistances (1-plug: 158 ± 7 Ω, 4-plug: 31 ± 14 Ω) compared to contacts to buried gold (1-plug: 346 ± 37 Ω, 4-plug: 52 ± 3 Ω). Further reductions are expected for multi-plug structures with increased areal density. Proof-of-concept mm-scale LIG electrochemical devices with local contact plugs yielded rapid electron transfer kinetics (rate constant k 0 ∼ 0.017 cm sâˆ'1), comparable to values measured for exposed Au films (k 0 ∼0.023 cm s)âˆ'1. Our results highlight the potential for integration of LIG-based sensor electrodes with semiconductor or roll-to-roll manufacturing. [ABSTRACT FROM AUTHOR]