Toward realization of high-throughput hyperspectral imaging technique for semiconductor device metrology.

MLA

Yoon, Changhyeong, et al. “Toward Realization of High-Throughput Hyperspectral Imaging Technique for Semiconductor Device Metrology.” Journal of Micro/Nanolithography, MEMS & MOEMS, vol. 21, no. 2, Apr. 2022, p. 21209. EBSCOhost, https://doi.org/10.1117/1.JMM.21.2.021209.

APA

Yoon, C., Park, G., Han, D., Im, S., Jo, S., Kim, J., Kim, W., Choi, C., & Lee, M. (2022). Toward realization of high-throughput hyperspectral imaging technique for semiconductor device metrology. Journal of Micro/Nanolithography, MEMS & MOEMS, 21(2), 21209. https://doi.org/10.1117/1.JMM.21.2.021209

Chicago

Yoon, Changhyeong, Gwangsik Park, Daehoon Han, Sang-il Im, Sungmin Jo, Jinseob Kim, Wookrae Kim, Changhoon Choi, and Myungjun Lee. 2022. “Toward Realization of High-Throughput Hyperspectral Imaging Technique for Semiconductor Device Metrology.” Journal of Micro/Nanolithography, MEMS & MOEMS 21 (2): 21209. doi:10.1117/1.JMM.21.2.021209.