Focused electron beam deposited silicon dioxide derivatives for nano-electronic applications.

The material and electrical properties of silicon dioxide derived insulators formed with a focused electron beam in the presence of a TEOS or TMCTS precursor are presented. Raman and energy dispersive X-ray spectroscopy were used to analyse the chemical structure and composition of the deposited dielectric. It was found that the TEOS precursor induced a purer dielectric with a reduced carbon percentage (∼ 3 %) which was independent of the electron beam energy. An investigation with TMCTS showed the importance of using an additional water vapour supply as an in-situ oxidising co-reactant, suppressing the deposited carbon content by up to a factor of six. Leakage current and voltage breakdown measurements were used to calculate the effective resistance and the dielectric strength of the insulator. The two precursors formed insulators with similar electrical properties with effective resistances on the order of G Ω for < 100 nm thick depositions and dielectric strengths of 7 MV cm−1, equivalent to those found in sputtered silicon dioxides, but allowing high-resolution maskless lithography. [ABSTRACT FROM AUTHOR]