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Oblique Collision Experiment and Probability Calculation Model of Collision Coefficient Between Micrometer Particles and Silicone Rubber Insulators.

Authors :
Huang, Zhi-Cheng
Liu, Yun-Peng
Geng, Jianghai
Kong, Yixuan
Liu, Jixing
Jiang, Ling
Source :
IEEE Transactions on Dielectrics & Electrical Insulation. Apr2022, Vol. 29 Issue 2, p672-682. 11p.
Publication Year :
2022

Abstract

Studying the collision and rebound characteristics between particles and silicone rubber surfaces is the basis of establishing a scientific contamination deposition model for silicone rubber insulators. In this article, high-speed and microscopic imaging techniques are used to set up an experimental platform for tracking and filming the collision and rebound motion of micrometer particles. Key parameters in the semiempirical calculation formula of critical adhesion velocity and tangential and normal rebound coefficients of particles in the collision issue between particles and silicone rubber surface are also obtained in this article by the parameter optimization method based on experimental measurement results. In addition, a probability calculation model for tangent and normal rebound coefficients of particles is proposed based on the statistical analysis method. Findings show that the critical adhesion velocity of particles decreases with the increase of the particle diameter. Influenced by the roughness distribution of the silicone rubber surface, the tangent rebound coefficient and the ratio between the measurement results and the theoretical calculated values of normal rebound coefficients of particles in the oblique collisions obeys normal distributions. This article is valuable for studying the contamination mechanism of silicone rubber insulators. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
10709878
Volume :
29
Issue :
2
Database :
Academic Search Index
Journal :
IEEE Transactions on Dielectrics & Electrical Insulation
Publication Type :
Academic Journal
Accession number :
156719063
Full Text :
https://doi.org/10.1109/TDEI.2022.3157931