Cite
Multi-physics modeling and simulations on the curing process of one-component hemming adhesive under temperature cycle.
MLA
Li, Jianjun, et al. “Multi-Physics Modeling and Simulations on the Curing Process of One-Component Hemming Adhesive under Temperature Cycle.” Journal of Adhesion Science & Technology, vol. 36, no. 5, Mar. 2022, pp. 507–30. EBSCOhost, https://doi.org/10.1080/01694243.2021.1929015.
APA
Li, J., Zhu, W., Sun, H., & Tang, G. (2022). Multi-physics modeling and simulations on the curing process of one-component hemming adhesive under temperature cycle. Journal of Adhesion Science & Technology, 36(5), 507–530. https://doi.org/10.1080/01694243.2021.1929015
Chicago
Li, Jianjun, Wenfeng Zhu, Haitao Sun, and Genglin Tang. 2022. “Multi-Physics Modeling and Simulations on the Curing Process of One-Component Hemming Adhesive under Temperature Cycle.” Journal of Adhesion Science & Technology 36 (5): 507–30. doi:10.1080/01694243.2021.1929015.