Iodide-induced galvanic replacement of nickel film on copper as activator for electroless nickel-phosphorus plating.

MLA

Zhao, Qiuping, et al. “Iodide-Induced Galvanic Replacement of Nickel Film on Copper as Activator for Electroless Nickel-Phosphorus Plating.” Materials Letters, vol. 314, May 2022, p. N.PAG. EBSCOhost, https://doi.org/10.1016/j.matlet.2022.131833.

APA

Zhao, Q., Hu, G., Huang, R., Qiang, L., & Zhang, X. (2022). Iodide-induced galvanic replacement of nickel film on copper as activator for electroless nickel-phosphorus plating. Materials Letters, 314, N.PAG. https://doi.org/10.1016/j.matlet.2022.131833

Chicago

Zhao, Qiuping, Guanqun Hu, Rui Huang, Li Qiang, and Xingkai Zhang. 2022. “Iodide-Induced Galvanic Replacement of Nickel Film on Copper as Activator for Electroless Nickel-Phosphorus Plating.” Materials Letters 314 (May): N.PAG. doi:10.1016/j.matlet.2022.131833.