Interface and mechanical property of Cu/AlCoCrFeNi2.1 layered composites prepared by solid/liquid bonding.

• A Cu/EHEA composite was successfully fabricated via solid–liquid bonding. • Good metallurgical interface bonding was achieved by the element mutual diffusion. • The interface of Cu/EHEA composites possessed an excellent bonding strength. • An increase in hardness on the Cu side was associated with the formation of precipitates. In the present work, a layered composite consisting of pure copper (Cu) and AlCoCrFeNi 2.1 eutectic high entropy alloy (EHEA) was fabricated via solid/liquid bonding. The results demonstrated that the interface of Cu/EHEA layered composites had a good bonding strength. The element diffusion and mechanical property of the interface were analyzed. In the diffusion layer, no crack defects were formed. The interface microhardness was about 210 HV. The tensile strength of the Cu/EHEA composite was ∼ 150 MPa, indicating that the interface strength was higher than that of pure Cu. The layered Cu/EHEA composite is a promising candidate with the excellent comprehensive performance. [ABSTRACT FROM AUTHOR]