Enhanced thermal performance of phase change material-integrated fin-type heat sinks for high power electronics cooling.

MLA

Kim, Su Ho, et al. “Enhanced Thermal Performance of Phase Change Material-Integrated Fin-Type Heat Sinks for High Power Electronics Cooling.” International Journal of Heat & Mass Transfer, vol. 184, Mar. 2022, p. N.PAG. EBSCOhost, https://doi.org/10.1016/j.ijheatmasstransfer.2021.122257.

APA

Kim, S. H., Heu, C. S., Mok, J. Y., Kang, S.-W., & Kim, D. R. (2022). Enhanced thermal performance of phase change material-integrated fin-type heat sinks for high power electronics cooling. International Journal of Heat & Mass Transfer, 184, N.PAG. https://doi.org/10.1016/j.ijheatmasstransfer.2021.122257

Chicago

Kim, Su Ho, Chang Sung Heu, Jin Yong Mok, Seok-Won Kang, and Dong Rip Kim. 2022. “Enhanced Thermal Performance of Phase Change Material-Integrated Fin-Type Heat Sinks for High Power Electronics Cooling.” International Journal of Heat & Mass Transfer 184 (March): N.PAG. doi:10.1016/j.ijheatmasstransfer.2021.122257.