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Mixed-Cell-Height Detailed Placement Considering Complex Minimum-Implant-Area Constraints.

Authors :
Chen, Jianli
Chang, Yao-Wen
Wu, Yen-Yi
Source :
IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems. Oct2021, Vol. 40 Issue 10, p2128-2141. 14p.
Publication Year :
2021

Abstract

Mixed-cell-height circuits have prevailed in advanced technology to address various design requirements. Along with device scaling, complex minimum-implant-area (MIA) constraints arise as an emerging challenge in modern circuit designs, adding to the difficulties in mixed-cell-height placement. Existing MIA-aware detailed placement with single-row-height standard cells is insufficient for mixed-cell-height designs: 1) filler insertion, typically used to resolve MIA violations, might incur unaffordable area and wirelength overheads and 2) mixed-height-cell perturbation could cause severe inter-row MIA violations. This article addresses the mixed-cell-height detailed placement problem considering both intra- and inter-row MIA constraints. We first fix intrarow violations by clustering violating mixed-height cells of the same threshold voltage, and then perturb each cluster to obtain a desired cell permutation by applying an efficient, optimal dynamic-programming-based algorithm for a special case and Algorithm DLX for general ones, where a provably constant performance ratio for a mixed-cell-height reshaping problem can be achieved. With a network-flow-based formulation, remaining violating cells are placed in appropriate filler-insertion positions to fix cell violations and minimize area. After performing mixed-cell-height detailed placement, we finally fix inter-row violations by shifting violating cells in minimum displacement. Experimental results show that our algorithm can efficiently solve all MIA violations without any extra area overhead. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
02780070
Volume :
40
Issue :
10
Database :
Academic Search Index
Journal :
IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems
Publication Type :
Academic Journal
Accession number :
153710604
Full Text :
https://doi.org/10.1109/TCAD.2020.3032619