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Exploiting 2D Coordinates as Bayesian Priors for Deep Learning Defect Classification of SEM Images.
- Source :
-
IEEE Transactions on Semiconductor Manufacturing . Aug2021, Vol. 34 Issue 3, p436-439. 4p. - Publication Year :
- 2021
-
Abstract
- Deep Learning approaches have revolutionized in the past decade the field of Computer Vision and, as a consequence, they are having a major impact in Industry 4.0 applications like automatic defect classification. Nevertheless, additional data, beside the image/video itself, is typically never exploited in a defect classification module: this aspect, given the abundance of data in data-intensive manufacturing environments (like semiconductor manufacturing) represents a missed opportunity. In this work we present a use case related to Scanning Electron Microscope (SEM) images where we exploit a Bayesian approach to improve defect classification. We validate our approach on a real-world case study and by employing modern Deep Learning architectures for classification. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 08946507
- Volume :
- 34
- Issue :
- 3
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Semiconductor Manufacturing
- Publication Type :
- Academic Journal
- Accession number :
- 153128005
- Full Text :
- https://doi.org/10.1109/TSM.2021.3088798