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Exploiting 2D Coordinates as Bayesian Priors for Deep Learning Defect Classification of SEM Images.

Authors :
Arena, Simone
Bodrov, Yury
Carletti, Mattia
Gentner, Natalie
Maggipinto, Marco
Yang, Yao
Beghi, Alessandro
Kyek, Andreas
Susto, Gian Antonio
Source :
IEEE Transactions on Semiconductor Manufacturing. Aug2021, Vol. 34 Issue 3, p436-439. 4p.
Publication Year :
2021

Abstract

Deep Learning approaches have revolutionized in the past decade the field of Computer Vision and, as a consequence, they are having a major impact in Industry 4.0 applications like automatic defect classification. Nevertheless, additional data, beside the image/video itself, is typically never exploited in a defect classification module: this aspect, given the abundance of data in data-intensive manufacturing environments (like semiconductor manufacturing) represents a missed opportunity. In this work we present a use case related to Scanning Electron Microscope (SEM) images where we exploit a Bayesian approach to improve defect classification. We validate our approach on a real-world case study and by employing modern Deep Learning architectures for classification. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
08946507
Volume :
34
Issue :
3
Database :
Academic Search Index
Journal :
IEEE Transactions on Semiconductor Manufacturing
Publication Type :
Academic Journal
Accession number :
153128005
Full Text :
https://doi.org/10.1109/TSM.2021.3088798