Enhanced strength, ductility and electrical conductivity of Cu–Te alloys via dynamic recrystallization and precipitation.

The mechanical and electrical properties of continuously cast Cu-0.4 wt%Te alloy produced by continuous extrusion forming at 800 °C were investigated. It was found that this thermomechanical processing was an effective way to induce the formation of refined recrystallized grain and promote dynamic precipitation of Te atom, thereby simultaneously improving the strength, ductility and electrical conductivity of Cu-0.4 wt%Te alloy. • Ultrafine grained Cu-0.4Te alloy obtained by continuous extrusion forming at 800 °C (termed as HCEF process). • Refined recrystallized grain with high coordinated deformation ability significantly increase the strength-ductility. • Dynamic precipitation during HCEF process was accelerated due to the high activation energy at elevated temperature. • Improved precipitation of Te atom in Cu matric induced the increase in electrical conductivity of Cu-0.4Te alloy. [ABSTRACT FROM AUTHOR]