Back to Search Start Over

Dissipative heat energy on Cu and Al2O3 ethylene–glycol-based nanofluid flow over a heated semi-infinite vertical plate.

Authors :
Mishra, A. K.
Pattnaik, P. K.
Mishra, S. R.
Senapati, N.
Source :
Journal of Thermal Analysis & Calorimetry. Jul2021, Vol. 145 Issue 1, p129-137. 9p.
Publication Year :
2021

Abstract

The present analysis describes the effect of dissipative heat energy transfer in Ethylene–Glycol (EG) based on conducting nanofluid over a heated semi-infinite vertical plate past through a porous medium. Uniform magnetic field, heat source/sink, and the effect of particle concentration also have been discussed by incorporating in the energy and solutal transfer equations, respectively. In addition to that, the thermal properties of the nanofluid are affected by the thermal slip boundary condition since; the temperature slip is favorable for the reduction in the heat transfer. Assuming self-similar transformations, the governing PDEs are transformed into non-linear coupled ODEs. These transformed equations are solved by using semi-analytical techniques such as Adomian Decomposition Method (ADM). The characteristics of different parameters on the flow phenomena are obtained and presented via graphs. The numerical values of the thermophysical properties of both the nanoparticles and the base fluid are shown in the table. Validation of the present work is obtained by comparing our result with the earlier established result and it is found that both the results are coinciding with each other. However, the main quantified results are the following: due to heavy density of the Cu nanoparticles, increasing volume fraction in ethylene–glycol base fluid resists the fluid motion and the inclusion of dissipative heat energy is favorable to enhance the nanofluid temperature. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
13886150
Volume :
145
Issue :
1
Database :
Academic Search Index
Journal :
Journal of Thermal Analysis & Calorimetry
Publication Type :
Academic Journal
Accession number :
150855002
Full Text :
https://doi.org/10.1007/s10973-020-09666-z