Pulsed Laser Punching of Through Holes in Optically Thick Glass and Ceramic Plates.

Analytic relations for calculating the energy density needed to punch holes through optically thick nonmetallic materials are derived for several variants of the action of the laser radiation within the scope of the one-dimensional problem of the vaporization of the absorbing layer of matter with 'prompt' deposition of the energy of a laser pulse. Analytic relations are derived for calculating the vaporized mass of material per unit energy input. A comparative analysis is made of the variants of the laser action on a plate, showing that the energy consumption in punching holes through optically thick glass and ceramic plates can be decreased. [ABSTRACT FROM AUTHOR]