Stress-driven grain refinement in a microstructurally stable nanocrystalline binary alloy.

Deformation-induced grain-growth in nanocrystalline materials is a widely-reported phenomenon that has been attributed to grain boundary (GB) processes. In this paper, we report on the opposite phenomenon, wherein a stable nanocrystalline (NC) Cu-Ta alloy undergoes a further refinement of the nano-grains during severe plastic deformation (SPD). SPD up to 250% results in a significant grain-size reduction despite the 350°C increase in temperature caused by the deformation process. Experiments and atomistic-simulations show that this unexpected grain-refinement is a direct result of well-dispersed Ta-nanoclusters throughout grain centers and along GBs acting as kinetic-pinning agents and suppressing GB processes that occur during recrystallization. Image, graphical abstract [ABSTRACT FROM AUTHOR]