Cite
LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults.
MLA
Ni, Tianming, et al. “LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults.” IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems, vol. 39, no. 10, Oct. 2020, pp. 2938–51. EBSCOhost, https://doi.org/10.1109/TCAD.2019.2946243.
APA
Ni, T., Yao, Y., Chang, H., Lu, L., Liang, H., Yan, A., Huang, Z., & Wen, X. (2020). LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults. IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems, 39(10), 2938–2951. https://doi.org/10.1109/TCAD.2019.2946243
Chicago
Ni, Tianming, Yao Yao, Hao Chang, Lin Lu, Huaguo Liang, Aibin Yan, Zhengfeng Huang, and Xiaoqing Wen. 2020. “LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults.” IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems 39 (10): 2938–51. doi:10.1109/TCAD.2019.2946243.