Structural and mechanical characterization of sputtered CuxNi100-x thin film using molecular dynamics.

Molecular dynamics (MD) simulations have been employed to simulate the deposition process of Cu and Ni atoms on the Ni (001) substrate with the different compositions in the Cu x Ni 100-x film. Then, the mechanical characteristics of Cu x Ni 100-x /Ni substrate are investigated during the nanoindentation process. The deformation behavior in the nanoindentation process is also investigated when the parameter for velocity, temperature changes. The lattice constant of CuNi alloy increases as Cu content in CuNi alloy rising. In the case of different contents of Cu atoms, the force, hardness of the Cu x Ni 100-x /Ni substrate reduce as increasing the content of Cu. The shear strain and von Mises stress region increase as increasing the temperature and the loading velocity after the loading process. The plastic and elastic deformation of the Cu x Ni 100-x /Ni substrate formed during nanoindentation. The force and hardness of the Cu x Ni 100-x /Ni substrate reduce as increasing the temperature. In addition, with the higher loading speed, the force and hardness values become larger. The dislocation density increases as increasing the indentation depth after the loading process. The specimen of the deposition Cu x Ni 100-x on Ni(001), the specimen Cu x Ni 100-x /Ni substrate and shear strain in the nanoindentation process. Image 1 • As Cu content in Cu x Ni 100-x film rises the lattice constant of deposited CuNi film increases. • The high-shear strain area of the Cu x Ni 100-x /Ni substrate propagates to interface in the indentation process. • The force, hardness of Cu x Ni 100-x /Ni substrate decreases as increasing the content Cu and temperature. • The force, hardness of Cu 40 Ni 60 /Ni substrate increases as increasing the loading velocity. • The dislocations density increases as increasing the temperature and the loading velocity. [ABSTRACT FROM AUTHOR]