Reliability Assessment of Solder Joints in Electronic Devices Under Extreme Thermal Fluctuations.

MLA

Surendar, A., et al. “Reliability Assessment of Solder Joints in Electronic Devices Under Extreme Thermal Fluctuations.” IEEE Transactions on Components, Packaging & Manufacturing Technology, vol. 10, no. 8, Aug. 2020, pp. 1394–400. EBSCOhost, https://doi.org/10.1109/TCPMT.2020.3005215.

APA

Surendar, A., Kavitha, M., Arun, M., & Panwar, V. (2020). Reliability Assessment of Solder Joints in Electronic Devices Under Extreme Thermal Fluctuations. IEEE Transactions on Components, Packaging & Manufacturing Technology, 10(8), 1394–1400. https://doi.org/10.1109/TCPMT.2020.3005215

Chicago

Surendar, A., M. Kavitha, M. Arun, and V. Panwar. 2020. “Reliability Assessment of Solder Joints in Electronic Devices Under Extreme Thermal Fluctuations.” IEEE Transactions on Components, Packaging & Manufacturing Technology 10 (8): 1394–1400. doi:10.1109/TCPMT.2020.3005215.