Microwave absorption and thermal conductivity properties of HO-BNNS@Fe3O4 composites.

With the rapid development of electronic technology and the integration of electronic chips, electromagnetic wave pollution and thermal management have become two critical issues hindering the growth of electronic equipment. In this work, an effective strategy has been developed for the synthesis of well-designed core-shell layered structures with hydroxylated boron nitride (HO-BNNS) core and Fe 3 O 4 shell. The as-prepared HO-BNNS@Fe 3 O 4 composites have both microwave absorption and thermal management properties. Moreover, these two performances show a synergistic effect. It is worth noting that the minimum reflection loss (RL min) of HO-BNNS@Fe 3 O 4 composite materials are −45.31 dB at 8.64 GHz with a thickness of 2 mm. Additionally, the thermal conductivity of HO-BNNS@Fe 3 O 4 composites are 1.75 W m−1K−1 at an HO-BNNS weight of 30%, which increases approximately 400% than the initial Fe 3 O 4. These comprehensive properties of HO-BNNS@Fe 3 O 4 composites make it have potential applications in the field of electronic equipment packaging. Image 1 The highlights of this paper are list below: ● An effective strategy has been developed for the synthesis of well-designed core-shell layered structures with hydroxylated boron nitride (HO-BNNS) core and Fe 3 O 4 shell. ● The as-prepared HO-BNNS@Fe 3 O 4 composites have both microwave absorption and thermal management properties. ● The microwave absorption and thermal management performance of the HO-BNNS@Fe 3 O 4 composites show a synergistic effect. [ABSTRACT FROM AUTHOR]