Tensile deformation and microstructures of Sn–3.0Ag–0.5Cu solder joints: Effect of annealing temperature.

MLA

Tang, Wenbin, et al. “Tensile Deformation and Microstructures of Sn–3.0Ag–0.5Cu Solder Joints: Effect of Annealing Temperature.” Microelectronics Reliability, vol. 104, Jan. 2020, p. N.PAG. EBSCOhost, https://doi.org/10.1016/j.microrel.2019.113555.

APA

Tang, W., Long, X., & Yang, F. (2020). Tensile deformation and microstructures of Sn–3.0Ag–0.5Cu solder joints: Effect of annealing temperature. Microelectronics Reliability, 104, N.PAG. https://doi.org/10.1016/j.microrel.2019.113555

Chicago

Tang, Wenbin, Xu Long, and Fuqian Yang. 2020. “Tensile Deformation and Microstructures of Sn–3.0Ag–0.5Cu Solder Joints: Effect of Annealing Temperature.” Microelectronics Reliability 104 (January): N.PAG. doi:10.1016/j.microrel.2019.113555.