聚合物纳米石墨烯复合材料导热性能研究进展.

With the development of electronics？ spaceflight and aviation, the integrated circuit develops rapidly, but it is often accompanied by the problem of heat dissipation ？ which affects the efficiency and the life of instruments. Considering the weight, corrosion resistance？ processing technology and cost？ polymer composites are the most promising materials for thermal conductivity. However, the inherent thermal conductivity of polymers is very low, so improving the thermal conductivity of polymers is very important for their applications in these fields ？ which has become a very important research topic in the past two decades. Tn this review paper, the following two aspects were mainly introduced. The micro thermal conductivity mechanism of polymers was analyzed and summarized from three aspects of molecular chain morphology ？ chain structure and inter-chain coupling. The main research progress in the thermal conductivity of graphene-filled polymer nanocomposites in recent years and the research challenges in the future were highlighted. [ABSTRACT FROM AUTHOR]