Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film.

MLA

Hu, Xiaowu, et al. “Shear Strength and Fracture Behavior of Solder/Kovar Joints with Electroplated Cu Film.” Vacuum, vol. 167, Sept. 2019, pp. 428–37. EBSCOhost, https://doi.org/10.1016/j.vacuum.2019.07.002.

APA

Hu, X., Bao, N., & Li, Q. (2019). Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film. Vacuum, 167, 428–437. https://doi.org/10.1016/j.vacuum.2019.07.002

Chicago

Hu, Xiaowu, Nifa Bao, and Qinglin Li. 2019. “Shear Strength and Fracture Behavior of Solder/Kovar Joints with Electroplated Cu Film.” Vacuum 167 (September): 428–37. doi:10.1016/j.vacuum.2019.07.002.