A new FE model for predicting the bridging micromechanisms of a Z-pin.

A new cohesive damage model was proposed to analyze the Mode I, Mode II, and mixed-mode bridging micromechanisms of a single Z-pin in the quasi-isotropic laminate. One zero-thickness cohesive element was embedded into each pair of adjacent elements in the damage zone to model the multi-directional Z-pin failure including splitting and rupture, snubbing damage in the resin-rich region, and interfacial debonding during bridging. The FE predicted bridging laws and damage modes of the Z-pin under Mode I, 30° and 60° mixed-mode, Mode II loading all agreed well with the experimental results. Besides, it was found that the splitting damage of the Z-pin and the snubbing damage in the resin-rich region were non-negligible. [ABSTRACT FROM AUTHOR]