Preparation of environmental-friendly conductive silver paste and properties of electronic paper.

Conductive silver paste is a key functional material for the preparation of electronic components. Conductive silver paste with silver and starch used as conductive fillers was prepared by redox method with molar ratio of starch to silver nitrate of 2: 1, 1 : 1, 1 : 2 and 1 : 3. The effect of physical factors, such as heating and sintering, ultraviolet light irradiation, soaking water, and ultrasonic wave, on the conductivity of the conductive silver paste was studied by measuring resistance, and the morphology of the conductive silver paste was observed with a microscope. The results showed that when the starch/silver nitrate was 1 : 3, the uniform conductive particles with starch as core and silver particles as shell were formed. When the ratio was 1 : 2 and 1 : 3, the resistivity decreased to 60% to 70% of the initial value during the low-temperature heating and sintering. The resulting silver paste was resistant to UV light, blisters and ultrasound. Among them, the conductivity for the sample prepared with the molar ratio of 1 : 3 was the best. Finally, a silver paste with a starch/silver nitrate ratio of 1 : 3 was mixed with 30%, 45%, or 60% of the ink, coated with paper, and subjected to low-temperature thermal sintering, and the resulting electronic paper had a resistivity of 10 mΩ/cm. [ABSTRACT FROM AUTHOR]