Development of a via-hole connection process via intense pulsed light sintering with Cu micro/Ag nano-hybrid ink for a multi-layered flexible printed circuit board.

MLA

Chu, Ji-Hyeon, et al. “Development of a Via-Hole Connection Process via Intense Pulsed Light Sintering with Cu Micro/Ag Nano-Hybrid Ink for a Multi-Layered Flexible Printed Circuit Board.” Thin Solid Films, vol. 680, June 2019, pp. 1–11. EBSCOhost, https://doi.org/10.1016/j.tsf.2019.04.015.

APA

Chu, J.-H., Joo, S.-J., & Kim, H.-S. (2019). Development of a via-hole connection process via intense pulsed light sintering with Cu micro/Ag nano-hybrid ink for a multi-layered flexible printed circuit board. Thin Solid Films, 680, 1–11. https://doi.org/10.1016/j.tsf.2019.04.015

Chicago

Chu, Ji-Hyeon, Sung-Jun Joo, and Hak-Sung Kim. 2019. “Development of a Via-Hole Connection Process via Intense Pulsed Light Sintering with Cu Micro/Ag Nano-Hybrid Ink for a Multi-Layered Flexible Printed Circuit Board.” Thin Solid Films 680 (June): 1–11. doi:10.1016/j.tsf.2019.04.015.