Fragmentation and adhesion properties of Cu-Zr amorphous thin films on polyimide substrates.

The fragmentation of Cu75Zr25 amorphous films with varying film thickness on polyimide substrates has been investigated by uniaxial tensile testing, in combination with in situ electrical resistivity measurements, optical microscopy and atomic force microscopy. It is revealed that the cracking strain monotonically increases as decreases, which can be attributed to the constraint effect of film thickness on shear band formation and the columnar structures in the thicker films. Similarly, the buckling strain also increases with decreasing , with the delamination of Cu75Zr25 amorphous films following the strain energy criterion. The adhesion energy between Cu75Zr25 film and polyimide is estimated to be of ∼ 6.5 J m−2 based on the buckle geometry. [ABSTRACT FROM AUTHOR]