Deposition of pure Cu films on glass substrates by decomposition of Cu complex pastes at 250 °C and additional Cu plating.

Highlights • Cu complex particles were synthesized by a mechano-chemical method and converted into a paste. • Paste film printed on a glass was decomposed during heating at 250 °C under nitrogen atmosphere. • Maximum adhesion of formed Cu film was attained with a ratio of Cu complexes to α-terpineol of 6:4. • The adhered Cu film indicated spike-shaped microstructure stuck in the glass at the Cu/glass interface. • Sheet resistance of the Cu film was 0.167 Ω/sq and decreased to 0.084 Ω/sq after additional Cu plating. Abstract Pure Cu film strongly adherent to glass substrates was deposited by printing Cu(COOH) 2 -containing paste and decomposing it at 250 °C in nitrogen atmosphere. The complete transformation of Cu(COOH) 2 into Cu required 30 min and generated a low sheet resistance of 0.167 Ω/sq (volume resistivity: 15.0 μΩ·cm). Maximum adhesion between the Cu film and substrate was attained at the Cu complexes:α-terpineol mixing ratio of 6:4 by weight. The spike-shaped microstructure at the Cu/glass interface was determined to be the main cause for the outstanding adhesion properties. The resistance further decreased to 0.084 Ω/sq by increasing the thickness and modifying the surface of the Cu film via electroless Cu plating. [ABSTRACT FROM AUTHOR]