Interplay of structural, electronic, and transport features in copper alloys.

Abstract Copper alloys show a structural variability leading to a range of diverse electronic, transport, and mechanical properties. Here, we investigate the influence of the type and amount of alloying on the electronic transport properties across copper alloys. Specifically, we investigate the electronic transmission along copper in its fcc crystal structure. The characteristic change when adding impurities, such as nickel, aluminum, and silicon in the structure and transport properties is assessed through density functional theory calculations together with the non-equilibrium Greens functions approach. The results are analyzed with respect to the structural characteristics, the electronic and transport properties in these alloys for different concentrations of the impurities. A clear trend in the electronic transmission, thus the conductance, along these materials was found with the addition of certain impurities and their clusters. Coherent with experimental observations, we conclude that the higher the concentration of the impurities, the lower the electronic transmission along the alloys as compared to a pure copper crystal. Furthermore, we show that the bonding environment in the impurity clusters can be associated to additional valence states and significantly influences the conductance. In the end, we discuss the relevance of our results for practical applications. Highlights • Impurities enhance valence band of alloy. • Conductance decrease of Cu alloy pronounced for Si. • Impurity clusters enhance Cu alloy conductance. • High impurity concentration decreases the conductance of Co alloys. [ABSTRACT FROM AUTHOR]