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Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy.
- Source :
-
Surface & Coatings Technology . Jan2019, Vol. 358, p753-761. 9p. - Publication Year :
- 2019
-
Abstract
- Abstract The requirements of low resistivity and small magnetic permeability in the high-frequency signal delivery applications have driven the development of Ni-free surface finishes, such as Au/Pd (EPIG) or Au/Pd/Au (IGEPIG), over the Cu conducting lines. The compatibility of these newly developed surface finish techniques with microelectronic packages and their long-term, high temperature reliability still require investigations in the current state. We conducted a solderability evaluation on the Au/Pd/Cu and Au/Pd/Au/Cu multilayers and found no noticeable differences of the intermetallic compound species (i.e., (Cu,Pd) 6 Sn 5 and Cu 3 Sn) in the joint interfaces between the two examined cases. However, numerous bump voids might be formed in the vicinity of the solder/Cu interface of the EPIG case, degrading the shear resistance of solder joints. The formation mechanism of the bump voids and the evolution kinetics were proposed in this study. Highlights • A comparative study between Au/Pd/Cu (EPIG) and Au/Pd/Au/Cu (IGEPIG). • Au nanolayer (10 nm) inhibited the bump void formation. • Bump voids merged as larger ones upon soldering. • Bump voids degraded the LSBS resistance of solder joints. • IGEPIG surface finish possesses better solderability than EPIG. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 02578972
- Volume :
- 358
- Database :
- Academic Search Index
- Journal :
- Surface & Coatings Technology
- Publication Type :
- Academic Journal
- Accession number :
- 133827248
- Full Text :
- https://doi.org/10.1016/j.surfcoat.2018.11.085