Kontrollü Doğrusal Katılaştırılan Al-Cu Alaşımının Mikroyapısı, Mekanik ve Elektriksel Özelliklerinin Katılaştırma Hızına Bağlı Değişimi.

Although it has a lot of usage area in the industry because the Al-Cu alloy is defined among the base alloys, the uncontrolled solidified casting of this alloy does not always have the desired properties and performance. For the production of Al-Cu alloys with superior properties, the solidification parameters known as the solidification rate, temperature gradient and composition ratio are changed and the results of this change are evaluated. It is known that changing the properties of the microstructure by growth rate affects the mechanical, electrical and thermal properties of the materials. For this reason, Al-%33 wt. Cu eutectic composition to carrying out correctly microstructure evaluation was prepared, then controlled solidification experiments were carried out by a Bridgman type furnace at a constant temperature gradient (G = 8.50 K/mm) and at five different growth ratios (V = 8.25˗164.80 μm/s). Thus, the effect of the growth rate on the microstructure was investigated and values of microhardness, tensile strength and electrical resistivity were investigated with the effect of change in the microstructure. Both linear regression analysis and Hall-Petch type correlations were used to determine the relationship between microstructure, microhardness, tensile strength and electrical resistivity values. The results obtained in this work were compared with the previous similar experimental results. [ABSTRACT FROM AUTHOR]