Ultrasonic-assisted hot pressing of Bi2Te3-based thermoelectric materials.

MLA

Mei, Deqing, et al. “Ultrasonic-Assisted Hot Pressing of Bi2Te3-Based Thermoelectric Materials.” Materials Science in Semiconductor Processing, vol. 87, Nov. 2018, pp. 126–33. EBSCOhost, https://doi.org/10.1016/j.mssp.2018.07.019.

APA

Mei, D., Wang, H., Yao, Z., & Li, Y. (2018). Ultrasonic-assisted hot pressing of Bi2Te3-based thermoelectric materials. Materials Science in Semiconductor Processing, 87, 126–133. https://doi.org/10.1016/j.mssp.2018.07.019

Chicago

Mei, Deqing, Hui Wang, Zhehe Yao, and Yang Li. 2018. “Ultrasonic-Assisted Hot Pressing of Bi2Te3-Based Thermoelectric Materials.” Materials Science in Semiconductor Processing 87 (November): 126–33. doi:10.1016/j.mssp.2018.07.019.