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The nucleation-controlled intermetallic grain refinement of Cu-Sn solid-liquid interdiffusion wafer bonding joints induced by addition of Ni particles.
- Source :
-
Scripta Materialia . Nov2018, Vol. 156, p1-5. 5p. - Publication Year :
- 2018
-
Abstract
- In this study, Ni particle was validated as an effective grain refiner for the Cu-Sn solid-liquid interdiffusion (SLID) wafer bonding joints, which induced a dispersive non-interfacial nucleation of intermetallic grains, effectively preventing the grain mergence phenomenon. With increasing the Ni particle addition, there were significant reductions in both the (Cu, Ni) 6 Sn 5 grain size and the Cu 3 Sn layer thickness, 6 wt% addition of Ni particles even led a formation of the intermetallic joints only consisted of (Cu, Ni) 6 Sn 5 grains with an average grain size of 1.3 μm. (Cu, Ni) 6 Sn 5 grain refinement could notably enhanced the shear strength of the intermetallic joints. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 13596462
- Volume :
- 156
- Database :
- Academic Search Index
- Journal :
- Scripta Materialia
- Publication Type :
- Academic Journal
- Accession number :
- 131070167
- Full Text :
- https://doi.org/10.1016/j.scriptamat.2018.07.006