Cite

Classification of Mixed-Type Defect Patterns in Wafer Bin Maps Using Convolutional Neural Networks.

MLA

Kyeong, Kiryong, and Heeyoung Kim. “Classification of Mixed-Type Defect Patterns in Wafer Bin Maps Using Convolutional Neural Networks.” IEEE Transactions on Semiconductor Manufacturing, vol. 31, no. 3, Aug. 2018, pp. 395–402. EBSCOhost, https://doi.org/10.1109/TSM.2018.2841416.



APA

Kyeong, K., & Kim, H. (2018). Classification of Mixed-Type Defect Patterns in Wafer Bin Maps Using Convolutional Neural Networks. IEEE Transactions on Semiconductor Manufacturing, 31(3), 395–402. https://doi.org/10.1109/TSM.2018.2841416



Chicago

Kyeong, Kiryong, and Heeyoung Kim. 2018. “Classification of Mixed-Type Defect Patterns in Wafer Bin Maps Using Convolutional Neural Networks.” IEEE Transactions on Semiconductor Manufacturing 31 (3): 395–402. doi:10.1109/TSM.2018.2841416.