Readily Processable Hole‐Transporting Peropyrene Gels.

Abstract: The development of organic electronics requires scalable solution‐processing methods that enable the fabrication of electronic devices over large areas at low cost. The preparation of peropyrene gels constituted of 3D networks of entangled 1D ribbon‐like fibrils that extend over the μm scale are now reported. OFETs were easily fabricated by depositing the gels in the sol state over bottom‐gate bottom‐contact transistors and by allowing its gelation thereafter. Electrical characterisation of such field‐effect transistors shows a good balance between processability and performance with hole mobilities that are two orders of magnitude higher than those observed in thin films obtained from non‐gelating solvents under the same conditions. [ABSTRACT FROM AUTHOR]