Enhanced performance of GaN-based LEDs via electroplating of a patterned copper layer on the backside.

MLA

Tawfik, Wael Z., et al. “Enhanced Performance of GaN-Based LEDs via Electroplating of a Patterned Copper Layer on the Backside.” Journal of Materials Science, vol. 53, no. 12, June 2018, pp. 8878–86. EBSCOhost, https://doi.org/10.1007/s10853-018-2177-8.

APA

Tawfik, W. Z., Hyun, G. Y., Lee, S. J., Ryu, S.-W., Ha, J.-S., & Lee, J. K. (2018). Enhanced performance of GaN-based LEDs via electroplating of a patterned copper layer on the backside. Journal of Materials Science, 53(12), 8878–8886. https://doi.org/10.1007/s10853-018-2177-8

Chicago

Tawfik, Wael Z., Gil Yong Hyun, Seong Jea Lee, Sang-Wan Ryu, Jun-Seok Ha, and June Key Lee. 2018. “Enhanced Performance of GaN-Based LEDs via Electroplating of a Patterned Copper Layer on the Backside.” Journal of Materials Science 53 (12): 8878–86. doi:10.1007/s10853-018-2177-8.