Thermodynamic characteristics, microstructure and mechanical properties of Sn-0.7Cu-xIn lead-free solder alloy.

The microstructure and mechanical properties of Sn-0.7Cu solder alloy and Sn-0.7Cu with 1.0–5.0 wt% indium addition were investigated in this study. With indium added into Sn-0.7Cu solder, the melting temperature decreased and the reaction temperature increased. Coarse grains of Cu 6 (Sn,In) 5 intermetallic compounds (IMCs) were formed in the alloy matrix when the indium content increased to 1.0 wt%. Indium was evenly distributed in the β-Sn phase and Cu 6 (Sn,In) 5 IMCs in as-prepared In-containing solder alloys. After isothermal aging, indium accumulated gradually in the Cu 6 (Sn,In) 5 IMCs while decreasing its content in the β-Sn phase. Tensile test results indicated that the ultimate tensile strength increased obviously and that the elongation decreased significantly with indium addition. Sawtooths were observed in the stress-strain curves of all aged In-containing alloys. A model describing a coherent relationship between the β-Sn phase and the Cu 6 (Sn,In) 5 phase was proposed to explain this phenomenon. The fracture surface of the Sn-0.7Cu alloy exhibited a ductile fracture mode while a mixed ductile-brittle fracture mode occurred when excessive indium was added into Sn-0.7Cu alloys. [ABSTRACT FROM AUTHOR]