Formation of black silicon using SiGe self-assembled islands as a mask for selective anisotropic etching of silicon.

Simple technique of formation of “black silicon” using wet chemical etching of crystalline Si wafers with SiGe self-assembled islands is proposed. The main idea consists of the utilization of SiGe islands as a mask for wet anisotropic etching of Si in alkali-based solution at the first etching stage and further removal of SiGe residuals by etching in a HF:H 2 O 2 :CH 3 COOH mixture at the second etching stage. Initial samples were the crystalline Si wafers with SiGe islands formed on them by deposition of 2.5–14 nm of Ge at 800 °C. After the two above-mentioned etching steps a submicron relief on a Si surface was formed. Investigation of optical properties of fabricated structures revealed significant decrease of reflection (AM 1.5 G weighted reflection ~2–3%) and increase of absorption in the wavelength range of 500–1200 nm. Due to the very small amount of Si removal (<0.5 µm), utilization of standard chemicals for Si-based solar cell technology and potential suitability for usage in large-scale manufacturing the proposed technique is promising for increasing of efficiency of thin wafers crystalline Si solar cell. [ABSTRACT FROM AUTHOR]