Thermal modelling of integrated microscale heatsink structures.

In this article a new methodology is introduced to create a ladder-type analytical thermal model for microscale channel based heatsink structures. The presented model is applicable to determine the local heat transfer(s) and the temperature distribution along the channel depending on the channel geometries, the thermal properties of the fluid and the wall temperature(s). The channel is divided into several segments and for each segment a T-equivalent circuit is created. The ladder-type thermal model obtained by applying the T-equivalent subcircuit as a building block can be used as a compact model of microscale channel structures. This model was implemented in a conventional thermal field solver (CTFS) simulation tool to augment the capability of simulating the thermal impact of integrated heat sink structures even with radial channel pattern. The implementation steps and the results are compared to the analytically calculated, CFD modelled and measured values. This augmented CTFS engine gives the opportunity to investigate the operation of system-on-package devices by electro/logi-thermal simulation. [ABSTRACT FROM AUTHOR]