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Diffusivities and atomic mobilities for fcc Cu–Ni–Sn alloys.

Authors :
Liu, Yuling
Chen, Chong
Liu, Dandan
Du, Yong
Liu, Shuhong
Tao, Xiaoma
Ouyang, Yifang
Source :
CALPHAD. Dec2017, Vol. 59, p84-89. 6p.
Publication Year :
2017

Abstract

Utilizing five groups of bulk diffusion couples together with electron probe microanalysis technique, the composition-dependent ternary interdiffusion coefficients in fcc Cu–Ni–Sn alloys at 1023 K were determined via the Whittle and Green method. The presently obtained interdiffusion coefficients at 1023 K as well as our previously measured ones at 1073 K were combined with the slightly modified thermodynamic descriptions of the fcc Cu–Ni–Sn phase to explore atomic mobilities of Cu, Ni and Sn in fcc Cu–Ni–Sn alloys within the CALPHAD framework. In order to be consistent with the thermodynamic description, atomic mobilities in binary fcc Ni–Sn alloys were re-evaluated in the present work. The quality of the assessed kinetic characteristics was confirmed by the comprehensive comparisons between various model-predicted diffusion behaviors and the experimental ones, including concentration profiles and diffusion paths. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
03645916
Volume :
59
Database :
Academic Search Index
Journal :
CALPHAD
Publication Type :
Academic Journal
Accession number :
126253844
Full Text :
https://doi.org/10.1016/j.calphad.2017.08.005