Cite
Analytical Equivalent Circuit Modeling for BGA in High-Speed Package.
MLA
Jin, Shuai, et al. “Analytical Equivalent Circuit Modeling for BGA in High-Speed Package.” IEEE Transactions on Electromagnetic Compatibility, vol. 60, no. 1, Feb. 2018, pp. 68–76. EBSCOhost, https://doi.org/10.1109/TEMC.2017.2726560.
APA
Jin, S., Liu, D., Chen, B., Brooks, R., Qiu, K., Lim, J., & Fan, J. (2018). Analytical Equivalent Circuit Modeling for BGA in High-Speed Package. IEEE Transactions on Electromagnetic Compatibility, 60(1), 68–76. https://doi.org/10.1109/TEMC.2017.2726560
Chicago
Jin, Shuai, Dazhao Liu, Bichen Chen, Rick Brooks, Kelvin Qiu, Jane Lim, and Jun Fan. 2018. “Analytical Equivalent Circuit Modeling for BGA in High-Speed Package.” IEEE Transactions on Electromagnetic Compatibility 60 (1): 68–76. doi:10.1109/TEMC.2017.2726560.