Short-term copper intrauterine device placement improves the implantation and pregnancy rates in women with repeated implantation failure.

MLA

Mao, Xiaoyan, et al. “Short-Term Copper Intrauterine Device Placement Improves the Implantation and Pregnancy Rates in Women with Repeated Implantation Failure.” Fertility & Sterility, vol. 108, no. 1, July 2017, p. 55–61.e1. EBSCOhost, https://doi.org/10.1016/j.fertnstert.2017.05.014.

APA

Mao, X., Zhang, J., Chen, Q., Kuang, Y., & Zhang, S. (2017). Short-term copper intrauterine device placement improves the implantation and pregnancy rates in women with repeated implantation failure. Fertility & Sterility, 108(1), 55–61.e1. https://doi.org/10.1016/j.fertnstert.2017.05.014

Chicago

Mao, Xiaoyan, Jie Zhang, Qiuju Chen, Yanping Kuang, and Shaozhen Zhang. 2017. “Short-Term Copper Intrauterine Device Placement Improves the Implantation and Pregnancy Rates in Women with Repeated Implantation Failure.” Fertility & Sterility 108 (1): 55–61.e1. doi:10.1016/j.fertnstert.2017.05.014.