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High-speed Cu electrodeposition and its solderability.
- Source :
-
Surface & Coatings Technology . Jun2017, Vol. 320, p559-567. 9p. - Publication Year :
- 2017
-
Abstract
- The effects of the plating current density ( j ) on the electroplated Cu microstructure, impurity distribution, and the solderability of the electroplated Cu were investigated. Analyses of electron backscatter diffraction and transmission electron microscopy showed that the Cu grain size ( D ) decreased from microscale to submicron-scale, and the predominant crystallographic orientation translated from [111]||ND + [101]||ND into [101]||ND (ND: Cu deposition direction) with increasing j . Time-of-flight secondary ion mass spectrometry analysis showed that the impurity content in the Cu platings (especially the Cl content) increased as a function of j . These investigations showed that j posed a significant influence on the characteristics of the electroplated Cu. Two intermetallic compound (IMC) species (η-Cu 6 Sn 5 and Cu 3 Sn) accompanied with some material defects (e.g., nanovoids and microcracks) formed at the solder/Cu pillar interface after reflow. The IMC (Cu 6 Sn 5 ) growth morphology and orientation, and the defect distribution were also strongly j -dependent. These j -dependent interfacial microstructures were closely related to different D and impurity contents of the Cu platings. The results of this study advanced our understanding of the effects of j on electrochemical metal deposition, and they were helpful in the development of the high-speed Cu electrodeposition technology. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 02578972
- Volume :
- 320
- Database :
- Academic Search Index
- Journal :
- Surface & Coatings Technology
- Publication Type :
- Academic Journal
- Accession number :
- 123061205
- Full Text :
- https://doi.org/10.1016/j.surfcoat.2016.11.016