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Length scale effect on the thermal stability of nanoscale Cu/Ag multilayers.
- Source :
-
Materials Science & Engineering: A . Feb2017, Vol. 686, p142-149. 8p. - Publication Year :
- 2017
-
Abstract
- The annealing induced grain growth (GG) and heterogeneous interface evolution of Cu/Ag multilayers with individual layer thickness ( h ) varying from 5 to 50 nm were investigated by transmission electron microscopy (TEM). The results demonstrate that the thermal stability of Cu/Ag multilayers exhibits strong length scale dependence. For samples with h <20 nm, the heterogeneous interfaces completely disappear when the annealing temperature exceeds 200 °C. However, the temperature for stable layered structure can reach 300 °C as the h ≥20 nm, w h ere the interfaces remain remarkably intact. The existence of a large number of grain boundaries (GBs) decrease the stability of multilayers, while more heterogeneous interfaces contribute to resisting atomic diffusion, inhibiting GG. The equilibrium is achieved by a competitive process between GBs diffusion and heterogeneous interfaces resistance. Moreover, the formation of annealing twins in multilayer also significantly improve the microstructural stability. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 09215093
- Volume :
- 686
- Database :
- Academic Search Index
- Journal :
- Materials Science & Engineering: A
- Publication Type :
- Academic Journal
- Accession number :
- 121067437
- Full Text :
- https://doi.org/10.1016/j.msea.2017.01.048