Study on the microstructure and mechanical properties of Cu-Sn intermetallic joints rapidly formed by ultrasonic-assisted transient liquid phase soldering.

MLA

Liu, J. H., et al. “Study on the Microstructure and Mechanical Properties of Cu-Sn Intermetallic Joints Rapidly Formed by Ultrasonic-Assisted Transient Liquid Phase Soldering.” Journal of Alloys & Compounds, vol. 692, Jan. 2017, pp. 552–57. EBSCOhost, https://doi.org/10.1016/j.jallcom.2016.08.263.

APA

Liu, J. H., Zhao, H. Y., Li, Z. L., Song, X. G., Dong, H. J., Zhao, Y. X., & Feng, J. C. (2017). Study on the microstructure and mechanical properties of Cu-Sn intermetallic joints rapidly formed by ultrasonic-assisted transient liquid phase soldering. Journal of Alloys & Compounds, 692, 552–557. https://doi.org/10.1016/j.jallcom.2016.08.263

Chicago

Liu, J.H., H.Y. Zhao, Z.L. Li, X.G. Song, H.J. Dong, Y.X. Zhao, and J.C. Feng. 2017. “Study on the Microstructure and Mechanical Properties of Cu-Sn Intermetallic Joints Rapidly Formed by Ultrasonic-Assisted Transient Liquid Phase Soldering.” Journal of Alloys & Compounds 692 (January): 552–57. doi:10.1016/j.jallcom.2016.08.263.