Stationary contact line formation and particle deposition in dip coating.

The stationary contact line formation and particle deposition in the evaporation regime of dip coating is investigated numerically by solving the conservation equations of mass, momentum, energy, vapor mass fraction, and particle concentration. A sharp-interface level-set method for tracking the liquid–gas interface is extended to include the effect of phase change and to treat the particle deposition as well as the liquid–gas–solid contact line on a moving substrate. The computations demonstrate that the particle deposition occurs spontaneously near the stationary contact line and the deposition thickness depends on the deposition rate constant and the substrate withdrawal velocity. [ABSTRACT FROM AUTHOR]