Cite
Extreme fast filling of conical shape through-silicon vias in 3 minutes and additive optimization.
MLA
Hoang, Van Ha, and Kazuo Kondo. “Extreme Fast Filling of Conical Shape Through-Silicon Vias in 3 Minutes and Additive Optimization.” Electrochimica Acta, vol. 212, Sept. 2016, pp. 270–76. EBSCOhost, https://doi.org/10.1016/j.electacta.2016.06.021.
APA
Hoang, V. H., & Kondo, K. (2016). Extreme fast filling of conical shape through-silicon vias in 3 minutes and additive optimization. Electrochimica Acta, 212, 270–276. https://doi.org/10.1016/j.electacta.2016.06.021
Chicago
Hoang, Van Ha, and Kazuo Kondo. 2016. “Extreme Fast Filling of Conical Shape Through-Silicon Vias in 3 Minutes and Additive Optimization.” Electrochimica Acta 212 (September): 270–76. doi:10.1016/j.electacta.2016.06.021.