One step synthesis of Ag nano-filler for e-ink and its low temperature metallization.

To form a conducting network at a low temperature in printed electronic circuits, conductive metal fillers for e-inks have to be small in size because the melting point of a nanoparticle (NP) is inversely correlated with its radius. We prepared NP using a one-step synthesis process with direct ligand exchange and the nano-materials showed metallization at low temperatures. TEM images showed that the final spherical particles have diameters of 5.4 ± 0.7 nm. The metallization of the silver NP was confirmed with SEM images and the metallization mechanism is discussed in detail. The results indicated that sinterization necks appeared with heat-treatment below 200 °C. [ABSTRACT FROM AUTHOR]