Thermal characteristics and fabrication of silicon sub-mount based LED package.

MLA

Kim, Young-Pil, et al. “Thermal Characteristics and Fabrication of Silicon Sub-Mount Based LED Package.” Microelectronics Reliability, vol. 56, Jan. 2016, pp. 53–60. EBSCOhost, https://doi.org/10.1016/j.microrel.2015.10.010.

APA

Kim, Y.-P., Kim, Y.-S., & Ko, S.-C. (2016). Thermal characteristics and fabrication of silicon sub-mount based LED package. Microelectronics Reliability, 56, 53–60. https://doi.org/10.1016/j.microrel.2015.10.010

Chicago

Kim, Young-Pil, Young-Shin Kim, and Seok-Cheol Ko. 2016. “Thermal Characteristics and Fabrication of Silicon Sub-Mount Based LED Package.” Microelectronics Reliability 56 (January): 53–60. doi:10.1016/j.microrel.2015.10.010.